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23. - 26. April 2024
Chinaplas
Shanghai, China |
06. - 10. May 2024
NPE
Orlando, USA |
15. - 19. October 2024
Fakuma
Friedrichshafen, Germany |
Unlocking new era of productivity
Emerson sees Boundless Automation™ as industry inflection point to address data barriers & modernize operations
Breaking ground in smart manufacturing
Xuansheng successfully produced high-quality molded parts in the first trial using Moldex3D
Data utilization in parallel in real and virtual environments
Yaskawa launches YASKAWA Cell Simulator (YCS), an engineering tool to realize a digital twin environment
Achieving optimally resource-saving production
WITTMANN BATTENFELD present innovations in the area of HiQ application software packages