Smart Molding International 3-2021

simulation 41 www.smart-molding.com (High Performance Computing). Engi - neers can run molding simulation effi - ciently on the remote Linux HPC cluster, on private or on public cloud, making it possible to analyze and calculate mil - lions of elements in minutes. Enhanced accuracy in advanced process and composite materials. Meet and surmount demands from rapidly changing industry The market always pursues progress. Advanced process simulation needs to be more precise. Moldex3D never stops constructing high-end advanced process prediction capabilities, assist - ing companies to be more competitive in product development and optimiza - tion. Moldex3D’s non-matching mesh technology reduces the mesh genera - tion time and improve the accuracy for RTM (Resin Transfer Molding) simula - tion of multi-layer fiber mat draping design. The new physical foaming ca - pabilities provide a new microscopic foaming prediction model, which greatly increases the prediction preci - sion of the existing modules of differ - ent foaming processes. In addition to the above break - throughs, Moldex3D 2021 also sup - ports Fiber-mat thermoplastic continu - ous fiberboard composite simulation. By setting the continuous fiber material property values, users can analyze how fiber orientation impacts product qual - ity and mechanical strength to further optimize their product designs. Complete support for IC Packaging process simulation. Flawlessly respond to every detail Due to the trend of intellectualiza - tion and electric vehicles, global indus - tries have rising demand on reliable IC product performance. Advanced IC packaging technology plays an increas - ingly critical role in manufacturing pro - cess. Moldex3D’s new potting simula - tion capabilities are now available for IC packaging users. The Pre-processing Wizard can quickly generate high-qual - ity mesh, which saves model prepara - tion time and helps users validate IC packaging design, reducing trial and error costs significantly. CoreTech SystemCo., Ltd. (Moldex3D) has been providing the professional CAE analysis solution “Moldex” series for the plastic injection molding indus - try since 1995, and the current product “Moldex3D” is marketed worldwide. Committed to providing advanced technologies and solutions to meet industrial demands, CoreTech System has extended its sales and service net - work to provide local, immediate, and professional service. CoreTech System presents innovative technology, which helps customers troubleshoot from product design to development, opti - mize design patterns, shorten time-to- market, and maximize product return on investment (ROI). CoreTech System www.moldex3d.com Nozzle Zone Wizard High-speed, detailed and multi-functional IC packaging process simulation RTM simulation supports non-matching mesh model