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27. - 30.
May 2025
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Milan, Italy
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08. - 15.
October 2025
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Düsseldorf,
Germany
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18. - 21.
November 2025
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Frankfurt am Main,
Germany
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Thermal stability and curing behavior of acrylate photopolymers
Experts from NETZSCH and the Technical University of Munich analyzed next-generation AM processes based on UV-curing
ProductionToGo to distribute Evonik’s 3D printing materials
New agreement, effective June 1, 2023, applies to INFINAM® branded photopolymers and PEEK filaments
Simulation provides insight and reliable improvement
At the Moulding Expo, SIGMA Engineering presents the simulation-based design of tempering systems using SIGMASOFT®
Expanding portfolio of 3D printing materials for industrial applications
Henkel launched new photopolymer resin for industrial 3D Printing at RAPID + TCT event