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18. - 21.
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Frankfurt am Main,
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03. - 06.
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05. - 10.
February 2026
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Combining expertise and patented technology
Inova Semiconductors and TactoTek® collaborate to advance intelligent, integrated lighting solutions
A go-to material for innovative sealing systems
TPS-EPDM bonding technology with THERMOLAST® K delivers reliable adhesion, efficiency, and sustainable performance
Rethinking plastics
PARAT Technology and FILL are boosting sustainability with top material efficiency and recycling capability
Key breakthrough in automotive parts molding localization
Tederic enters the global supply chain of leading automotive parts manufacturer with multiple NEO•E all-electric IMMs







