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Moldex3D 2025 Molding Intelligence from CoreTech System

Moldex3D 2025 Molding Intelligence from CoreTech System

News 28.03.2025

With the advancement of computing power and deep learning, intelligent technology can now assist in processing complex simulation data, detecting potential issues early, and providing concrete improvement suggestions. Moldex3D 2025 brings users more powerful intelligent prediction recommendations, customized and automated workflows, and precise and efficient simulation capability upgrades. These enhancements help enterprises more easily implement intelligent key assistance, improving product development efficiency and competitiveness.

The important updates and highlights of Moldex3D 2025 are as follows:

Comprehensive Performance Enhancements to Ensure Accurate and Efficient Simulation Results
Moldex3D 2025 continues to expand process support to meet the needs of different industries, ensuring that each simulation result helps users create more efficient production processes. The new version of Moldex3D provides a more stable hot runner injection pressure prediction optimization and introduces a new thermal pin simulation function. It effectively simulates the behavior of molten plastic in parts and hot runners and presents the temperature distribution of thermal pins during displacement, allowing for early optimization of processes and product quality. Additionally, the crystallinity output enables simulation of deformations caused by post-crystallization in both warpage and annealing stages, eliminating defects in advance.

In terms of pre-processing, Moldex3D introduces an automatic multi-component model matching function and a cooling channel curve connection repair tool. The former allows users to apply newly upgraded meshing functions to quickly create models when simulating processes with multiple inserts. Real-time warnings for incorrect contact surfaces help users quickly identify and fix problems. The latter assists users in repairing common curve connection issues in cooling channel construction with a single click. It also provides automatic detection and repair of disconnections, overlaps, and intersections, reducing manual correction errors and improving preprocessing accuracy and efficiency.

For global leading IC Packaging simulation, Moldex3D has continued its optimizations since last year’s Wire Bonding simulation, introducing a new Wire Debonding simulation. Users only need to enter customized pressure ranges and material types or adjust the pressure limits by dragging the color scale to display wire debonding conditions at different pressure levels. This allows for early prediction of wire debonding risk. CoreTech System has also enhanced IC modeling support functions to help users shorten modeling time, simplify operation steps, and focus on the core tasks of simulation and design.

Smoother Operations and More Comprehensive Result Interpretation
To improve efficiency, CoreTech System's team continues to optimize the user experience and result interpretation methods. Moldex3D 2025 now supports elliptical visualization for fiber results and 3D rendering of flakes, making the display clearer. Additionally, Moldex3D files have been optimized for size reduction, achieving up to a 66% decrease in capacity.

In terms of result interpretation, Moldex3D DOE has always helped users identify the best design from multiple parameters. Now, it supports real-time interactive predictions. Users can directly adjust different control factor values and observe predicted results, quickly optimizing designs for different scenarios. The latest Verification Template function allows users to define result evaluation standards during the simulation stage, displaying validation statuses instantly. Frequently used result views, evaluation criteria, and report output settings can also be saved as templates, enabling the rapid generation of standardized CAE analysis reports.

Workflow Automation to Enhance Production Efficiency
To meet enterprises’ demands for high-performance design processes, Moldex3D 2025 provides more intuitive automation functions, allowing engineers to quickly create simulation projects and perform analyses. With iSLM – Auto Launch, users only need to upload CAD files, and project creation and analysis can be initiated with a single click, enabling rapid design validation and optimization.

The developers from CoreTech System have also introduced Molding Window Advisor, which allows users to quickly set up systematic CAE scientific trial molding conditions, determine feasible molding conditions, and construct molding windows for subsequent adjustments and trial runs. Additionally, the developers have expanded API support for Shell, injection machines, and validation templates, allowing users to create customized automation workflows and achieve intelligent molding analysis.

Intelligent-Driven Simulation to Improve Design Decision Accuracy
In plastic injection molding simulation, utilizing intelligent technology can enhance both design and process efficiency and accuracy. Moldex3D 2025 integrates intelligent tools, introducing the AI Optimization Wizard. By providing a parameter range, the system automatically recommends parameters that meet the requirements. This tool is not only applicable to single-objective designs but also effectively handles multi-objective design needs, significantly increasing development efficiency and design quality.

iSLM has also launched two major intelligent tools: Gate Design Discovery and Mold Design Discovery. These tools enable rapid estimation of key information such as gate positions and numbers, machine selection, injection pressure, and clamping force distribution probabilities for new plastic part designs. This activation of smart assets allows past successful experiences to be applied to future development.

Additionally, Moldiverse has introduced the MoldiBot intelligent assistant, which provides rapid technical support and recommendations, helping users solve molding analysis problems in real-time and fully leverage the capabilities of Moldex3D.

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