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02. - 05.
June 2026
![]() Equiplast
Barcelona,
Spain
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02. - 04.
June 2026
![]() Interplas
Birmingham,
UK
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13. - 17.
October 2026
![]() Fakuma
Friedrichshafen,
Germany
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News
Thermal stability and curing behavior of acrylate photopolymers
Experts from NETZSCH and the Technical University of Munich analyzed next-generation AM processes based on UV-curing
Exhibiting at the Moulding Expo 2023
User-friendly tools, interesting CAD features and other digital services will be presented live on the HASCO Stand
Great opportunity to meet end users and customers
Nissei ASB exhibited its technology at "interpack 2023" trade fair in Düsseldorf, Germany, held in May
New mould design with indiscernible added value
Highlights of the sample plate 2.0 are the hologram and the low-friction structure at the corners









