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18. - 21.
November 2025
![]() Formnext
Frankfurt am Main,
Germany
|
03. - 06.
December 2025
![]() Plast Eurasia
Istanbul,
Turkey
|
05. - 10.
February 2026
![]() Plastindia
New Delhi,
India
|
Achieving optimally resource-saving production
WITTMANN BATTENFELD present innovations in the area of HiQ application software packages
Collision of ideas and cross-border exchanges
A delegation from the Singapore Precision Engineering and Technology Association (SPETA) has recently visited YIZUMI
Sustainable packaging combined with all-electric efficiency
By combining injection compression moulding and IML Sumitomo (SHI) Demag maximizes material efficiency and ensures full recyclability
Bringing high performance molds to Mexico and Latin America
StackTeck’s presence at Plastimagen 2023 includes a sustainable packaging solution