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28. - 30.
August 2024
![]() Asiamold Select
Shenzhen, China |
24. - 28.
September 2024
![]() Taipei Plas
Taipei, Taiwan |
15. - 19.
October 2024
![]() Fakuma
Friedrichshafen, Germany |
A broad proposal to meet every need
IPLAS India 2024: SACMI identified and proposed innovative solutions for sustainable rigid packaging
SACMI is leading the way for the future of rigid packaging
The company will bring its key technological innovations and new services to Fispal 2024
Mould making for customisable packaging
SACMI offers an all-round service, providing the latest technology and support, from product conception to after-sales
A profitable, future-proof transition
SACMI supports customers worldwide, helping them develop more efficient caps and facilitating the adoption of new standards