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25. - 27.
February 2025
![]() Asiamold Select
Guangzhou,China
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15. - 18.
April 2025
![]() Chinaplas
Shenzhen, China
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11. - 13.
March 2025
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Munich, Germany
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A broad proposal to meet every need
IPLAS India 2024: SACMI identified and proposed innovative solutions for sustainable rigid packaging
SACMI is leading the way for the future of rigid packaging
The company will bring its key technological innovations and new services to Fispal 2024
Smart, digital, connected technology for caps and performs
At Chinaplas 2024, manufacturers can take a close look at all of SACMI's profitable, ready-to-use, future-proof solutions
A profitable, future-proof transition
SACMI supports customers worldwide, helping them develop more efficient caps and facilitating the adoption of new standards